Shanghai Asin Optical Materials Co., Ltd-SiO;SiO2,evaporation materials, sputtering target material

Technical Data：

Breaking Strength
at Room Temperature
≥900Mpa
Fracture Toughness
at Room Temperature
6.0-8.0 Mpa.m1/2

Volume Density
3.20-3.4g/cm3
Volume Resistivity
at Room Temperature
1014Ω.cm

Relative Dielectric Constant
at Room Temperature
6-7
Heat Conductivity
23-25W/（m-k）

Thermal Expansion Coefficient
3.1×10-6/℃
Hardness
HRA92-94





Main Performance Indexes of Silicon Nitride Ceramics:：

Performance
Reactive Sintering
Silicon Nitride
Normal Pressure
Sintering Silicon Nitride
The Company’s
Hot Pressed Sintering
Silicon Nitride

Volume Density
（g/cm3）
2.21
3.15
3.2~3.3

Bending Strength（Mpa）
137.3
490.3
≥900

Fracture Toughness
(Mpa·m1/2)
2.17
4.71
6.0~8.0

Hardness
(HRA)
\
87.0
92.0~94.0

Heat Conductivity Coefficient
(W/m·k)
5.44
12.56
23~25

Thermal Expansion Coefficient
χ10-6 ℃
(RT~1200℃)
3.2
3.2
2.95~3