Dongguan Ziitek Electronical Material and Technology Ltd

Dongguan Zhaoke manufacturers supply 2.5W gray TIC808A thermal conductivity paste instead of TC-11 and T-PCM585 thermal conductivity phase change paste, TIC™808 thermal conductivity phase change is - low thermal resistance thermal conductivity phase change interface material. With a thickness of 0.2 mmT, at a temperature of 50°C, the TIC™808A begins to soften and flow, filling the subtle irregular gaps in the contact interface between the heat sink and the integrated circuit board to reduce thermal resistance. The TIC™808A series is a bendable solid state at room temperature and can be used independently without reinforcements, eliminating the influence of reinforcements on thermal conductivity.
The TIC™808A series does not degrade its thermal conductivity after 1000 hours at 130°C, or after repeated cycling tests from -25°C to 125°C. At operating temperatures, the PCM softens without completely liquefiing or spilling. It can be processed according to the customer's drawing specifications.