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yingstar

Yingstar Electronics Co.,Ltd

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2 Layer Temperature Seor FPC PCB Board Assembly 0.3mm Thickness1oz Copper And 5mil Conductive Spac


Unit Price:

Not informed

FOB Price:

Not informed

Minimum Order Quantity:

Not informed

Type of Payment:

L/C (Letter of Credit)

D/A (Documents Against Acceptance)

D/P (Documents Against Payment)

T/T (Wire Transfer)

Preferred Port:

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Reference:

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Description

2 layer FPC temperature senor board 0.2mm+0.1mm stiffener, YINGSTAR produce the PCB, source all the components and do the assembly&testing for customer.

YINGSTAR FPC board manufacturing capabilities:
Flexible PCB (1-10 laye)
Material: Kapton, Polymide, PET,
Base copper thickness: 1/3oz, 1/2oz, 1oz, 2oz;
Base PI thickness: 0.5mil, 0.7mil, 0.8mil, 1mil, 2mil;
Stiffener: Polyimide, Stainless stell, FR4,
Surface finish: Immeion Gold/ SilveTin, OSP.
Min widthpacing (1/3oz):0.05mm/0.06mm
Min widthpacing (1/2oz): 0.06mm/0.07mm

Detailed Specification of Flexible PCB Manufacturing

Technical Specification
Layers: 1~10 (flex Pcb) and 2~8 (rigid flex)
Min Panel Size: 5mm x 8mm
Max Panel Size: 250 x 520mm
Min Finished board thickness: 0.05mm (1 sided inclusive copper)
Max Finished board thickness: 0.3mm (2 sided inclusive copper)
Finished board thickness tolerance: ±0.02~0.03mm
Material: Kapton, Polyimide, PET
Base copper thickness (RA or ED): 1/3 oz, 1/2 oz, 1oz, 2oz
Base PI thickness: 0.5mil, 0.7mil, 0.8mil, 1mil, 2mil
Stiffner: Polyimide, PET, FR4, SUS
Min Finished hole diameter: Φ 0.15mm
Max Finished hole diameter: Φ 6.30mm
Finished hole diameter tolerance (PTH): ±2 mil ( ±0.050mm)
Finished hole diameter tolerance (NPTH): ±1 mil ( ±0.025mm)
Min width/spacing (1/3oz): 0.05mm/0.06mm
Min width/spacing (1/2oz): 0.06mm/0.07mm
Min width/spacing (1oz): Single layer: 0.07mm/0.08mm
Double layer: 0.08mm/0.09mm
Aspect Ratio 6:01 8:01
Base Copper 1/3Oz--2Oz 3 Oz for Prototype
Size Tolerance Conductor Width:±10% W ≤0.5mm
Hole Size: ±0.05mm H ≤1.5mm
Hole Registration: ±0.050mm
Outline Tolerance:±0.075mm L ≤50mm
Surface Treatment ENIG: 0.025um - 3um
OSP:
Immersion Tin: 0.04-1.5um
Dielectric Strength AC500V
Solder Float 288/10s IPC Standard
Peeling Strength 1.0kgf/cm IPC-TM-650
Flammability 94V-O UL

  • Circuit boards
  • electronic components

Production Capacity:

Not informed

Delivery Timeframe:

Not informed

Incoterms:

CFR - Cost and Freight

Packaging Details:

bubble bag and regular carton


More about
Yingstar Electronics Co.,Ltd

icone de usuario

50-100

Employees

sales icon

500K - 1M

Sales volume (USD)

icone de exportar

90%

% Export sales

2012

Year

Established


Business type
  • Industry / Manufacturer

Keywords
  • PCB Assembly
  • PCB prototype
  • PCB manufacturing

Contact and location
  • icone de usuario Zoe Chen
  • icone de telefone +86 755 xxxxxxxx
  • map-marker Shenzhen / Guangdong | China

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