General specification for Multi-layer printed circuit board 1, 4-38 layers 2, Board finished thickness: 0.3mm-7.0mm 3, Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen Free, Rogers,...

General specification for Multi-layer printed circuit board 1, 4-38 layers 2, Board finished thickness: 0.3mm-7.0mm 3, Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen Free, Rogers, Telfon. 4, Max. Finished board size: 23*25(580*900mm) 5, Min. Drilled hole size: 6mil(0.15mm) 6, Min. Line width: 3mil(0.075mm), Min. Line spacing: 3mil(0.075mm) 7, Surface finish/treatment: HASL/HASL lead free, Chemical tin, ENIG,Immersion Silver, OSP, etc. 8, Copper thickness: 0.5-20 oz 9, Solder mask color: Green/yellow/black/white/red/blue 10, Copper thickness in hole: >25.0 um(>1mil) 12L multilayer pcb Technical description,  Material: FR-4 Tg170 Board thickness: 1.6mm  Surface finished: Immersion gold+Controlled Impedance Copper thickness: 1 Oz for all layers  Min.line width/space: 4mil Min through hole: 0.15mm

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